According to a report, the company plans to produce 30,000 to 35,000 wafers utilizing 3nm process technology.
According to Wccftech, iPads are believed to be the first Apple products to be equipped with the processors, however no specific models have been mentioned.
Apple‘s M3 and A17 CPUs are slated to appear in iPhones, iPads, and Macs in 2023. Previous speculations say that the 3nm chips will have four dies, allowing for up to 40 cores, and that they will give higher performance and battery life.
In comparison, the Apple M1 CPU has eight cores, while the M1 Pro and M1 Max have up to ten cores.
Is TSMC falling behind schedule?
Previous reports about TSMC’s 3nm chip production timeline have been confirmed by this recent revelation. However, earlier this year, there was some alarming news that showed the tech behemoth was having problems with its CPUs.
The semiconductor manufacturing process is complex, and it is not uncommon for incorrect batches to emerge as a result. While many of these defective chips may be recycled for lower-powered versions, too many errors can be devastating.
TSMC holds a strong position in the semiconductor business, particularly in light of the current shortage, as it is able to deliver a consistent supply of chips to other companies. However, if TSMC fails to perfect its 3nm process, it might have an impact on AMD, Nvidia, and other companies that rely on 5nm technology.
To read our blog on “Apple’s iPhone 13 will be manufactured in India by Foxconn,” click here.
