MediaTek has unveiled the Dimensity 6300, its latest midrange chipset and the successor to last year’s Dimensity 6100+.
The new chipset includes an improved Cortex-A76 CPU cluster that is now overclocked to 2.4 GHz, up from 2.2 GHz. This updated CPU cluster includes two Cortex-A76 cores and six Cortex-A55 cores clocked at 2 GHz.
The Dimensity 6300, built using TSMC’s advanced 6nm manufacturing process, includes a Mali-G57 MC2 GPU. According to MediaTek, overclocked CPU cores improve performance by 10%.
In terms of power efficiency, MediaTek has included its UltraSave 3.0+ technology to extend battery life, and the chip’s new 5G modem complies with the 3GPP Release 16 standard.
In terms of compatibility, the chipset shares the same LPDDR4x RAM and UFS 2.2 storage specifications with its predecessor.
It supports displays with resolutions of up to 1080 x 2520 pixels and camera sensors up to 108MP. It also supports dual-band Wi-Fi 5 (a/b/g/n/ac) and Bluetooth 5.2 connectivity.
The Realme C65 5G is expected to be the first smartphone to use the new Dimensity 6300 chipset, with a launch date later this month. Other budget phones from Xiaomi, Oppo, and Vivo are expected to use the Dimensity 6300 chipset as well.
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